General Spring Connector
This new feature allows for the definition of orthotropic springs with unique stiffness values in all orthogonal directions, including torsional and bending stiffness. It enables more accurate analysis of component behaviour without the need for complex modelling.

Key Highlights:
- Supports orthotropic springs with unique stiffness in all orthogonal directions, including torsion and bending.
- Simplifies modelling by eliminating the need for complex component definitions.
Benefits:
- Improved Accuracy: Provides more accurate simulations of real-world component stiffness, including torsional and bending deformations.
- Streamlined workflows: Reduces computational time by focusing on the spring’s behaviour without detailed geometry
2.Enhanced Node-to-Surface Bonding
- This enhancement addresses the challenge of simulating bonded interactions between components with minor misalignments or offsets in their geometry. By allowing for more robust bonding, even when surfaces are not perfectly aligned.

Key Highlights:
- Supports solid-to-solid, shell-to-shell, and solid-to-shell bonding for offset geometries.
Benefits:
- Improved Accuracy: Improved solution accuracy for all bonding interactions that are based on either a draft-quality or high-quality mesh.
3. Enhanced Pin Connector
The introduction of a distributed coupling algorithm significantly improves the performance and accuracy of studies involving pin connectors. By ensuring that all nodes on cylindrical surfaces are included in the distributed coupling constraints, this feature addresses limitations from previous releases and enhances solution reliability.

Key Highlights:
- All nodes on cylindrical surfaces now participate in distributed coupling constraints, leading to more accurate results and improved performance for studies with pin connectors.
Benefits:
Improved Efficiency: Delivers higher simulation accuracy and reduces solution times when using the Intel Direct Sparse solver, especially for complex models with a large number of nodes.
4. Geometry Correction for Surface-to-Surface Bonding
The introduction of a distributed coupling algorithm enhances the performance of surface-to-surface bonding studies.

Key Highlights:
- The new bonding algorithm now corrects for geometry, giving a more accurate result for shapes like cylinders, spheres, and cones. As a result, it reduces stress noise near bonded areas, providing more reliable results.
Benefits:
- Improved Accuracy: In previous versions, only a subset of nodes participated in bonding constraints when the node count was very high. In SOLIDWORKS Simulation 2025, all nodes on interacting surfaces are included, improving both accuracy and simulation reliability.

